Electronic component package, electronic component

专利名称：Electronic component package, electronic

component package sealing member andmethod for producing the electroniccomponent package sealing member

发明人：Naoki Kohda申请号：US143484申请日：20120928公开号：US09620702B2公开日：20170411

专利附图：

摘要：The present invention relates to an electronic component package, an

electronic component package sealing member, and a method for producing theelectronic component package sealing member. A through hole is formed in a base so asto pass through between both main surfaces and of a base material of the base . An innerside surface of the through hole includes a curved surface that expands outward in awidth direction of the through hole

申请人：DAISHINKU CORPORATION

地址：Kakogawa-shi, Hyogo JP

国籍：JP

代理机构：American Patent Works

代理人：Marvin A. Motsenbocker

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